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Board Overview

The Omi uses three interconnected PCBs:
BoardFunctionLatest Version
MainboardnRF5340 SoC, nRF7002 Wi-Fi, microphones, IMU, flash, battery managementv1.2
Charger BoardMagnetic dock with pogo pins, USB-C power, ESD protectionv1.0
FPCFlexible cable connecting mainboard to charging contactsv1.0

The main PCB carries all active electronics.Key ICs:
ICFunction
nRF5340-CLAADual-core Bluetooth LE SoC (application + network cores)
nRF7002-CEAA-R7Wi-Fi 6 companion IC
CSNP4GCR01-DPW8GB NAND Flash
LSM6DS3TR-C6-axis IMU
BQ25101YFPRLi-Ion/Li-Poly battery charger
TPS628438YKARDC-DC buck converter
2x MMICT5838-00-012TDK T5838 PDM microphones
Files:
FileDescription
schematic.pdfFull schematic
gerbers/Gerber + drill files for PCB fabrication
altium/Altium Designer source project
The nRF5340 (WLCSP-95, 4.4x4.0mm) and nRF7002 (WLCSP-81, 3.75x3.4mm) are fine-pitch wafer-level packages. Requires stencil + solder paste + reflow. Do not hand solder.

How to Order PCBs

Upload the Gerber ZIP to any PCB manufacturer. Use the exact specs below per board:
ParameterMainboardCharger BoardFPC
Layers4 (F.Cu, In1.Cu, In2.Cu, B.Cu)22
MaterialFR4FR4Polyimide (flex)
Thickness0.6mm1.0mm0.3mm
Board Size21.0 x 21.0 mm13.0 x 20.0 mm29.3 x 12.5 mm
Surface FinishENIG (immersion gold)ENIGENIG
Min Trace/Space0.076mm / 0.076mm (3 mil)0.2mm / 0.127mm0.254mm / 0.1mm
Solder MaskBoth sidesBoth sidesBoth sides
Copper Weight1 oz outer, 1/3 oz inner1 oz1 oz
The mainboard has blind vias (L1-L2, L3-L4) and buried vias (L2-L3) — confirm your fab supports these before ordering. Total 414 drill hits including 159 blind + 55 buried vias.
Use ENIG surface finish for all boards. HASL causes bridging on the nRF5340 and nRF7002 fine-pitch pads (0.4mm).

View Full BOM

See the complete Bill of Materials with all 88 components

First Power-On Checklist

1

Visual Inspection

Check for solder bridges on QFN pads with a microscope or loupe. Verify all passives are placed correctly (check orientation of polarized capacitors).
2

Power Rails

Connect bench supply (set to 3.7V, current limit 100mA). Measure VBAT (3.7V at battery input), VDD_nRF (1.0V for nRF5340 core), and VDDH (3.3V for nRF5340 I/O).
If current draw exceeds 50mA before firmware flash, disconnect immediately — likely a short.
3

Flash Firmware

Connect SWD debugger (J-Link or nRF DK). Flash using nRF Connect SDK. See firmware guide.
4

Verify BLE

Open nRF Connect mobile app. The device should appear advertising as “Omi”. If not, check 32MHz crystal and antenna matching network.

Troubleshooting

Check BQ25101 output (3.7-4.2V). Verify TPS628438 buck converter has correct input. Look for solder bridges on QFN pads with microscope. Measure resistance between VCC and GND — should be more than 1k ohm before power.
Verify 32MHz crystal is soldered (not just tacked). Check 32.768kHz crystal for RTC. Measure nRF5340 VDDH (should be 3.3V) and VDD (1.0V). Check antenna trace and matching network.
nRF7002 requires its own 40MHz crystal. Check BUCKA/BUCKB rails. Verify SPI connection between nRF5340 and nRF7002. Wi-Fi requires firmware support enabled.
T5838 microphones are top-port — verify sound inlet faces the enclosure acoustic holes. Check PDM clock (1-3.25MHz) and data lines. Both mics must be in the correct PDM channel (L/R).
Check pogo pin contact resistance (less than 0.5 ohm). Verify FPC connection. Measure charger board USB-C VBUS (5V). Check TPS25200 eFuse output. Verify magnet polarity alignment.